MWC (Mobile World Congress) is one of the world’s largest connectivity exhibitions, showcasing the latest trends in next generation technologies, including communications and AI.
At this event, the Japan Pavilion—supported by Japan’s Ministry of Internal Affairs and Communications—will present Japan’s cutting edge vision for next generation communications and digital innovation, with 16 Japanese companies participating.
Enplas will exhibit as one of the participating companies within the Japan Pavilion, marking its second participation.
At MWC 2026, Enplas will exhibit an innovative 60GHz wireless communication demo that combines Enplas Lens Antenna with STMicroelectronics’ ST60 wireless communication module.
Enplas Lens Antenna is a compact product suitable for millimeter wave radar in the 60–300 GHz range and for 6G applications.
Please visit the Enplas booth. (Hall 6, 6E54, inside the Japan Pavilion)

Contact: op-sales@enplas.com
Enplas Lens Antenna Details: https://www.enplas.co.jp/english/inquiry/ofc-catalog-form/
MWC Barcelona 2026 : https://www.mwcbarcelona.com/
Booth: 6E54 (Hall 6, within the Japan Pavilion)
Event Dates: March 2 (Mon) – March 5 (Thu), 2026
Venue: Fira Gran Via, Barcelona, Spain