Business Outline
Semiconductor Peripherals
Technologies
Meeting the needs of small-scale production for diversified products with technology and quality assurance recognized by the world’s top maker.
Small-scale production, diversified products and quick delivery.
Design and development using advanced 3D technology.
Our product design system makes full use of 3D CAD simulation technology. In order to meet high level demand, we have built sophisticated design and development environments, with 3D automatic measuring and other cutting edge technologies. By taking advantage of numerous tools and analysis from multiple viewpoints, we produce reliable products and deliver on a timely basis.
A unique production system realizing quick delivery.
With an auto-assembly system, our flexible production system is capable of producing numerous products. Thanks to this unique system, we are able to immediately respond to all types of requests made for small-scale production of diversified products.
3D Design & Linear Simulation
Thermal Simulation
Non-Linear Simulation
3D Mechanical/Structural Simulation
0.3-mm fine-pitch socket
Aiming for higher quality Responding to the needs for ultra-fine pitch, higher pin count.
0.3-mm pitch, pin counts of over 3,000 made possible.
We have responded quickly to the trend in semiconductors towards ultra-fine pitch and ultra-high pin count by intensifying IC integration. By taking advantage of our original micro-fabrication technology and application technology of high-function resins, we have produced IC tests and burn-in sockets with 0.3 mm pitch and over 3,000 pins. By doing so, we contribute to the continuing development and production of semiconductors.
For more information about the Engineering Plastic Products, please contact us. Our addresses and phone numbers are available here.
Contacts&Locations
